March 2008

 
 

IEEE Communication Society and North American Taiwanese Engineer Association present the Next Generation Wireless Broadband Panel.



ComSoc SCV, NATEA, and MTT SCV

William Lee, Chairman, Treyspan Inc.

Rehan Jalil, CEO, Wichorus

Bruce Himebauch, Director, Atheros

Wednesday 12 March 2008

18:00 Refreshments

18:30 Introduction

18:40 LTE/HSPA by William Lee

19:00 WiMAX by Rehan Jalil

19:20 802.11n by Bruce Himebauch

19:40 Panel discussion

20:40 Adjourn

National Semiconductor

Building E, Conference Room

2900 Semiconductor DR

Santa Clara, CA 94052-8090

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Photo by Paul Nicholson.